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  this datasheet is under modification and could not be completed in time for this cd-rom. before designing in, please be so kind as to contact your nearest oki office or representative. the revised datasheet will be included in the next cd-rom issue. please also watch our web sites for further announcements. we sincerely apologise for any inconveniences. oki electric industry co., ltd., tokyo, japan device business group marketing communications tel: +81-3-5445-6027 fax: +81-3-5445-6058 email: brenner595@dm1.oii.oki.co.jp http://www.oki.co.jp/semi/
1 ? semiconductor MSM64164C ? semiconductor MSM64164C built-in rc oscillator type a/d converter and lcd driver 4-bit microcontroller general description the MSM64164C is a low power 4-bit microcontroller using oki original cpu core nx-4/20. the MSM64164C has the minimum instruction execution time of 7.5 m s (@400 khz) and has internal 4064-byte program memory, 256-nibble data memory, three 4-bit input-output ports, 4- bit input port, 4-bit output port, 2-channel rc oscillation, a/d converter, lcd driver for up to 120 segments, and buzzer output port. the MSM64164C is best suited for low power, high precision thermometers and hygrometers. features ? operating range operating frequencies : 32.768khz, 400 khz operating voltage : 1.25 to 1.7 v (1.5 v spec.) 2.0 to 3.5 v (3 v spec.) 2.2 to 3.5 v (1/2 duty) operating temperature : C40 to +85 c ? memory space internal program memory : 4064 bytes internal data memory : 256 nibbles ? minimum instruction execution time : 7.5 m s @400 khz 91.6 m s @32.768khz ? rc oscillation a/d converter : 2 channels time dividing 2-channel method ? lcd driver : 34; duty ratio switchable by software (1) at 1/4 duty and 1/3 bias : 120 segments (max) (2) at 1/3 duty and 1/3 bias : 93 segments (max) (3) at 1/2 duty and 1/2 bias : 64 segments (max) ? buzzer driver : 1 (4 output modes selectable) ? capture register : 2 channels ? watchdog timer ? clock : 32.768khz crystal oscillator and 400 khz rc oscillator (with an external resistor) cpu clock : 32.768khz/400 khz (switchable by software) time base clock : 32.768khz ? power supply voltage : 1.5 v/3 v (selectable by mask option) low power consumption ? i/o port input-output port : 3 ports 4 bits input port : 1 port 4 bits output port : 1 port 4 bits (8 out of the 34 lcd driver outputs can be used for another output-only port by mask option.) ? interrupt external interrupt : 2 sources internal interrupt : 8 sources e2e0035-28-41
2 MSM64164C ? semiconductor ? package options: MSM64164C-xxx : chip MSM64164C-xxxgs-bk : qfp80-1420-0.80-bk (biphenyl epoxy resin) MSM64164C-xxxgs-k : qfp80-1414-0.65-k (biphenyl epoxy resin) MSM64164C-xxxts-k : tqfp80-1212-0.50-k ? otp version msm64p164 (replaced the built-in program memory with one-time prom)
3 ? semiconductor MSM64164C block diagram bsr halt mief tr2 tr0 pcm c alu ba h l xy a7 - 0 (4) (4) rom 4064 bytes ram 256 nibbles bc (8) v ss1 v ss2 v ss3 c1 c2 l0 l1 l33 p2.0 p2.1 p4.3 p1.0 p1.1 p1.2 p1.3 p0.0 p0.1 p0.2 p0.3 v dd int port address in0 int int p0 p1 p2 p3 p4 lcd bias adc bd capr intc wdt int cs0 rs0 crt0 rt0 in1 cs1 rs1 rt1 bd ir romr sp timing controller tbc vr tst rstg 2clk (4) pcl pch tr1 a11 - 8 db7 - 0 (8) ir decoder 5 int v ssl tst2 tst1 reset xt xt osc1 osc2 db7 - 0 port address indicates the cpu core (nx-4/20). v ss v ss v ss v ss
4 MSM64164C ? semiconductor pin configuration (top view) rt1 41 v ss1 42 v ss 43 v ss2 44 v ss3 45 c1 46 c2 47 l17 48 l18 49 l19 50 l20 51 l21 52 l22 53 l23 54 l24 55 l25 56 l26/p5.0 57 l27/p5.1 58 l28/p5.2 59 l29/p5.3 60 l30/p6.0 61 l31/p6.1 62 l32/p6.2 63 l33/p6.3 64 rs1 40 cs1 39 in1 38 in0 37 cs0 36 rs0 35 crt0 34 rt0 33 v dd 32 v ssl 31 bd 30 p4.3 29 p4.2 28 p4.1 27 p4.0 26 p3.3 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 p3.2 p3.1 p3.0 p2.3 p2.2 p2.1 p2.0 l16 l15 l14 l13 l12 l11 l10 l9 l8 l7 l6 l5 l4 l3 l2 l1 l0 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 osc2 osc1 v dd xt xt reset tst1 tst2 p1.0 p1.1 p1.2 p1.3 p0.0 p0.1 p0.2 p0.3 (qfp80-1420-0.80-bk) 80-pin plastic qfp note: pin 32 and pin 67 are internally connected and v dd can be supplied from either pin 32 or pin 67.
5 ? semiconductor MSM64164C pin configuration (top view) (continued) v ss 41 v ss2 42 v ss3 43 c1 44 c2 45 l17 46 l18 47 l19 48 l20 49 l21 50 l22 51 l23 52 l24 53 l25 54 l26/p5.0 55 l27/p5.1 56 l28/p5.2 57 l29/p5.3 58 l30/p6.0 59 l31/p6.1 60 l32/p6.2 61 l33/p6.3 62 osc2 63 osc1 64 v ss1 40 rt1 39 rs1 38 cs1 37 in1 36 in0 35 cs0 34 rs0 33 crt0 32 rt0 31 v dd 30 v ssl 29 bd 28 p4.3 27 p4.2 26 p4.1 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 p4.0 p3.3 p3.2 p3.1 p3.0 p2.3 p2.2 p2.1 p2.0 l16 l15 l14 l13 l12 l11 l10 l9 l8 l7 l6 l5 l4 l3 l2 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 v dd xt xt reset tst1 tst2 p1.0 p1.1 p1.2 p1.3 p0.0 p0.1 p0.2 p0.3 l0 l1 (qfp80-1414-0.65-k) 80-pin plastic qfp
6 MSM64164C ? semiconductor pin configuration (top view) (continued) (tqfp80-1212-0.50-k) 80-pin plastic tqfp v ss 41 v ss2 42 v ss3 43 c1 44 c2 45 l17 46 l18 47 l19 48 l20 49 l21 50 l22 51 l23 52 l24 53 l25 54 l26/p5.0 55 l27/p5.1 56 l28/p5.2 57 l29/p5.3 58 l30/p6.0 59 l31/p6.1 60 l32/p6.2 61 l33/p6.3 62 osc2 63 osc1 64 v ss1 40 rt1 39 rs1 38 cs1 37 in1 36 in0 35 cs0 34 rs0 33 crt0 32 rt0 31 v dd 30 v ssl 29 bd 28 p4.3 27 p4.2 26 p4.1 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 p4.0 p3.3 p3.2 p3.1 p3.0 p2.3 p2.2 p2.1 p2.0 l16 l15 l14 l13 l12 l11 l10 l9 l8 l7 l6 l5 l4 l3 l2 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 v dd xt xt reset tst1 tst2 p1.0 p1.1 p1.2 p1.3 p0.0 p0.1 p0.2 p0.3 l0 l1 
7 ? semiconductor MSM64164C pin description basic function reset pin negative power supply at 3.0 v spec. bias output for driving lcd (C3.0 v) test pins resistance sensor connection pin for measurement output port (p1.0 : large current drive output port) input port input-output ports lcd driver pins output pin for the buzzer driver lcd driver pins, output ports by mask option function symbol description power supply oscillation port a/d converter reset test v dd v ss1 v ss2 v ssl c1, c2 xt xt osc1 osc2 p1.0 to p1.3 p0.0 to p0.3 p2.0 to p4.3 l0 to l25 bd l26/p5.0 to l33/p6.3 rt0 crt0 rs0 cs0 in0 rt1 rs1 cs1 in1 reset tst1 tst2 o i o i o o i i/o o o o 0v power supply negative power supply at 1.5 v spec. bias output for driving lcd (C1.5 v) capacitor connection pins for generating v ss1 , v ss2 , and v ss3 . negative power supply pin for internal logic (internally generated constant voltage) v ss3 bias output for driving lcd (C4.5 v). o o o i o o o i i i i low speed side clock oscillation input pins : connects to the crystal resonator (32.768khz) high speed side clock pins (400 khz) : connects to the external resistor of oscillation (r os ) resistance /capacitance sensor connection pin for measurement reference resistor connection pin reference capacitor connection pin oscillation input pin resistance sensor connection pin for measurement reference resistor connection pin reference capacitor connection pin oscillation input pin rc oscillation pins for a/d converter (channel 0) (crosc0) rc oscillation pins for a/d converter (channel 1) (crosc1) type v ss negative power supply for i/o port interface
8 MSM64164C ? semiconductor secondary function function symbol type description p3.3 i secondary function of p3.3: this pin is allocated to the data input of a serial port (sin). p4.0 o secondary function of p4.0: this pin is allocated to the data output of a serial port (sout). serial port p4.1 o secondary function of p4.1: this pin is allocated to the ready output of a serial port (spr). p4.2 i/o secondary function of p4.2: this pin is allocated to the clock input and output of a serial port (sclk). rc oscillation monitor secondary function of p4.3: this pin is a monitor output (mon) of an rc oscillation clock (oscclk) for an a/d converter and a 400 khz rc oscillation clock for a system clock. p4.3 o
9 ? semiconductor MSM64164C instruction list transfer instructions mnemonic operand b c description lai n 4 11a ? n 4 (vertical product instruction) lli n 4 11l ? n 4 (vertical product instruction) lhi n 4 22h ? n 4 lyi n 4 22y ? n 4 lxi n 4 22x ? n 4 lbs0i n 3 2 2 bsro ? n 3 lbs1i n 3 2 2 bsr1 ? n 3 lmi n 4 2 2 m(hl) ? n 4 lab 2 2 a ? b lal 1 1 a ? l lah 1 1 a ? h lay 1 1 a ? y lax 1 1 a ? x lam @xy 11a ? m(hl) lam m 8 22a ? m(xy) lamd 2 2 a ? m(m 8 ) lam+ 1 2 a ? m(hl), l ? l+1, skip if l=0 lamC 1 2 a ? m(hl), l ? lC1, skip if l=0f h lamm n 2 11a ? m(hl), h ? h n 2 lba 2 2 b ? a lla 1 1 l ? a lha 1 1 h ? a lya 1 1 y ? a lxa 1 1 x ? a lma 1 1 m(hl) ? a lma @xy 2 2 m(xy) ? a lmad m 8 2 2 m(m 8 ) ? a lma+ 1 2 m(hl) ? a, l ? l+1, skip if l=0 lmaC 1 2 m(hl) ? a, l ? lC1, skip if l=0f h notes: "b" refers to the byte length of an instruction. "c" refers to the number of execution machine cycles of an instruction.
10 MSM64164C ? semiconductor instruction list (continued) byte transfer instructions mnemonic operand b c description lbai n 8 22ba ? n 8 lhli n 8 22hl ? n 8 lxyi n 8 22xy ? n 8 lmbi n 8 22m b (hl) ? n 8 lmbi @xy, n 8 33m b (xy) ? n 8 lalb 2 2 ba ? hl layb 2 2 ba ? xy llab 2 2 hl ? ba lyab 2 2 xy ? ba lamb 1 2 ba ? m b (hl) lamb 2 3 ba ? m b (xy) lamdb 2 2 ba ? m b (m 8 ) lmab 1 2 m b (hl) ? ba lmab @xy 23m b (xy) ? ba lmadb m 8 22m b (m 8 ) ? ba lmtb 2 3 m b (hl) ? t(a 4 , xy) xab 1 2 a ? b xam 1 1 a ? m(hl) xam 2 2 a ? m(xy) xamd 2 2 a ? m(m 8 ) xam+ 1 2 a ? m(hl), l ? l+1, skip if l=0 xamC 1 2 a ? m(hl), l ? lC1, skip if l=0f h xamm 1 1 a ? m(hl), h ? h n 2 xamb 1 2 ba ? m b (hl) xamb 2 3 ba ? m b (xy) xamdb 2 2 ba ? m b (m 8 ) ais n 4 11a ? a+n 4 , skip if carry=1 adc 1 1 a, c ? a+m(hl)+c adc 2 2 a, c ? a+m(xy)+c ads ads exchange instructions operation instructions @xy m 8 @xy m 8 a 4 @xy m 8 n 2 @xy @xy a ? a+m(hl), skip if carry=1 a ? a+m(xy), skip if carry=1 11 22 note: "carry" refers to a carry of the operation result.
11 ? semiconductor MSM64164C instruction list (continued) notes: "carry" refers to a carry of the operation result. "borrow" refers to a borrow of the operation result. mnemonic operand b c description adcs 1 1 a,c ? a+m(hl)+c, skip if carry=1 adcs 2 2 a,c ? a+m(xy)+c, skip if carry=1 subc 1 1 a,c ? aCm(hl)Cc subc 2 2 a,c ? aCm(xy)Cc subs @xy 11a ? aCm(hl), skip if borrow=1 subs 2 2 a ? aCm(xy), skip if borrow=1 subcs 1 1 a,c ? aCm(hl)Cc, skip if borrow=0 subcs 2 2 a,c ? aCm(xy)Cc, skip if borrow=0 andi 2 2 and 1 1 and 2 2 ori 2 2 or 1 1 a ? a m(hl) or @xy 22a ? a m(xy) eori n 4 22a ? a n 4 eor 1 1 a ? a m(hl) eor 2 2 a ? a m(hl) cma 2 2 a ? a ral 1 1 c ? a 3 ? a 2 ? a 1 ? a 0 ? c rar 1 1 c ? a 3 ? a 2 ? a 1 ? a 0 ? c adcb 1 2 ba, c ? ba+ m b (hl)+c adcb 2 3 ba, c ? ba+ m b (xy)+c adsb 1 2 ba ? ba+ m b (hl), skip if carry=1 adsb 2 3 ba ? ba+ m b (xy), skip if carry=1 subcb 1 2 ba, c ? baC m b (hl)Cc subcb 2 3 ba, c ? baC m b (xy)Cc subsb 1 2 ba ? baC m b (hl), skip if borrow=1 subsb 2 3 ba ? baC m b (xy), skip if borrow=1 operation instructions byte operation instructions @xy n 4 @xy @xy @xy @xy n 4 @xy @xy @xy @xy a ? a n 4 a ? a m(hl) a ? a m(xy) a ? a n 4
12 MSM64164C ? semiconductor instruction list (continued) bit operation instructions mnemonic operand b c description sc 1 1 c ? 1 rc 1 1 c ? 0 tc 1 1 skip if c=0 sbe 1 1 bef ? 1 rbe 1 1 bef ? 0 sbc 1 1 bcf ? 1 rbc 1 1 bcf ? 0 smb 1 1 m(hl)[n 2 ] ? 1 smb 2 2 m(xy)[n 2 ] ? 1 smbd 2 2 m(m 8 )[n 2 ] ? 1 rmb 1 1 m(hl)[n 2 ] ? 0 rmb 2 2 m(xy)[n 2 ] ? 0 rmbd 2 2 m(m 8 )[n 2 ] ? 0 tab @xy, n 2 1 1 skip if a[n 2 ]=1 tmb n 2 1 1 skip if m(hl)[n 2 ] = 1 tmb 2 2 skip if m(xy)[n 2 ] = 1 tmbd 2 2 skip if m(m 8 )[n 2 ] = 1 ina 1 1 a ? a+1, skip if a=0 inl 1 1 l ? l+1, skip if l=0 inh 1 1 h ? h+1, skip if h=0 iny 1 1 y ? y+1, skip if y=0 inx 1 1 x ? x+1, skip if x=0 inm 1 1 m(hl) ? m(hl)+1, skip if m(hl)=0 inm 2 2 m(xy) ? m(xy)+1, skip if m(xy)=0 inmd 2 2 m(m 8 ) ? m(m 8 )+1, skip if m(m 8 )=0 dca 1 1 a ? aC1, skip if a=0f h dcl 1 1 l ? lC1, skip if l=0f h dch 1 1 h ? hC1, skip if h=0f h dcy 1 1 y ? yC1, skip if y=0f h dcx dcm n 2 n 2 @xy, n 2 m 8 @xy x ? xC1, skip if x=0f h m(hl) ? m(hl)C1, skip if m(hl)=0f h 11 11 increment/ decrement instructions dcm dcmd m 8 m(xy) ? m(xy)C1, skip if m(xy)=0f h m(m 8 ) ? m(m 8 )C1, skip if m(m 8 )=0f h 22 22 n 2 m 8 , n 2 @xy, n 2 m 8 , n 2 m 8 , n 2 @xy
13 ? semiconductor MSM64164C instruction list (continued) mnemonic operand b c description cai 2 2 skip if a=n 4 cli 2 2 skip if l=n 4 cmi 2 2 skip if m(hl)=n 4 cab 1 1 skip if a=b cam 1 1 skip if a=m(hl) cam 2 2 skip if a=m(xy) camd 2 2 skip if a=m(m 8 ) camb 1 2 skip if ba=m b (hl) camb 2 3 skip if ba=m b (xy) push 1 2 st ? ba, sp ? spC1 push 1 2 st ? hl, sp ? spC1 push 1 2 st ? bsr, sp ? spC1 pop 1 2 sp ? sp+1, ba ? st pop @xy 12sp ? sp+1, hl ? st pop n 4 12sp ? sp+1, bsr ? st jcp 1 1 pc 5-0 ? a 6 jp 2 2 pc 10-0 ? a 11 ljp 3 5 pc 11-0 ? a 12 ja 1 1 pc 5-0 ? ba(lower 6 bits) jm 1 3 pc 11-0 ? [m b (hl), ba] czp 1 4 st ? pc+1, pc 4-0 ? a 5 , pc 11-5 ? 0 sp ? spC2(a 5 is an even number of 10 h to 1e h ) cal 2 4 st ? pc+2, pc 10-0 ? a 11 , sp ? spC2 lcal 3 5 st ? pc+3, pc 11-0 ? a 12 , sp ? spC2 rt 1 3 pc 11-0 ? st, sp ? sp+2 rts 1 3 pc 11-0 ? st, sp ? sp+2, then skip rti 1 5 pc 11-0 ? ?c?hl?ba ? st, sp+4, mi ? 1 nop 1 1 no operation comparison instructions subroutine instructions hl bsr a 6 hl ba bsr ba a 11 branch instructions stack instructions n 4 n 4 @xy m 8 a 12 a 5 a 11 a 12
14 MSM64164C ? semiconductor memory maps program memory program memory map address 000h is the instruction execution start address by the system reset. the czp area from address 010h to address 01fh is the start address for the czp subroutine of one-byte call instruction. the start address of interrupt subroutine is assigned to the interrupt address from address 020h to 03dh. the user area has 4064 bytes of address 000h to address 0fdf. no program can be stored in the test program area. 0fffh 0fe0h 03eh 020h 010h 000h start address czp area interrupt area test program area 32 bytes 4064 bytes 8 bits contents of interrupt area 03bh 038h 035h 032h 02fh 02ch 029h 026h 023h 020h watchdog interrupt external interrupt (0) serial port interrupt external interrupt (1) adc interrupt 256hz interrupt 32hz interrupt 16hz interrupt 1hz interrupt 0.1hz interrupt
15 ? semiconductor MSM64164C data memory the data memory area consists of 8 banks and each bank has 256 nibbles (256 4 bits). the data ram is assigned to bank 7 and peripheral ports are assigned to bank 0. data memory map half the data ram area (128 nibbles) also serves as stack area. the stack is a memory starting from address 7ffh toward the low-order addresses where 4 nibbles are used by subroutine call instruction and 8 nibbles are used by an interrupt. the addresses 080h to 0ffh of bank 0 and the addresses 700h to 77fh of bank 7 are not assigned as the data memory, so access to these addresses has no effect. moreover, it is impossible to access bank 1 to bank 6. 7ffh bank7 data ram area (256 nibbles) 4 bits 780h 0ffh 080h 07fh 000h unused area bank 0 data/stack area (128 nibbles) contents of 000h to 07fh sfr area 07fh 000h inaccessible area 6ffh 700h 100h
16 MSM64164C ? semiconductor absolute maximum ratings (1.5 v spec) parameter symbol condition rating unit (v dd =0 v) power supply voltage 1 v ss1 ta=25c C2.0 to +0.3 v power supply voltage 2 v ss2 ta=25c C4.0 to +0.3 v power supply voltage 3 v ss3 ta=25c C5.5 to +0.3 v power supply voltage 4 v ssl ta=25c C2.0 to +0.3 v input voltage 1 v in1 v ss1 input, ta=25c v ss1 C0.3 to +0.3 v input voltage 2 v in2 v ss input, ta=25c v ss C0.3 to +0.3 v output voltage 1 v out1 v ss1 output, ta=25c v ss1 C0.3 to +0.3 v output voltage 2 v out2 v ss2 output, ta=25c v ss2 C0.3 to +0.3 v output voltage 3 v out3 v ss3 output, ta=25c v ss3 C0.3 to +0.3 v output voltage 4 v out4 v ss output, ta=25c v ss C0.3 to +0.3 v storage temperature t stg C55 to +125 c power supply voltage 5 v ss ta=25c C5.5 to +0.3 v input voltage 3 v in3 v ssl input, ta=25c v ssl C0.3 to +0.3 v output voltage 5 v out5 v ssl output, ta=25c v ssl C0.3 to +0.3 v recommended operating conditions (1.5 v spec) parameter symbol condition range unit (v dd =0 v) operating temperature t op C40 to +85 c 400 khz osc external resistance r os 250 to 500 k w x'tal oscillator frequency f xt 30 to 35 khz operating voltage v ss1 C1.7 to C1.25 v v ss C5.25 to v ss1 v
17 ? semiconductor MSM64164C electrical characteristics (1.5 v spec) dc characteristics (v dd =0 v, v ss1 =v ss =C1.5 v, ta=C40 to +85 c unless otherwise specified) parameter symbol condition unit measuring circuit v ss2 voltage v ss2 ca, cb, c12=0.1 m f min. typ. max. C3.2 C3.0 C2.8 +100% C50% v v ss3 voltage v ss3 ca, cb, c12=0.1 m f C4.7 C4.5 C4.3 +100% C50% v v ssl voltage v ssl C1.5 C1.3 C0.6 v v sta within 5 seconds after oscillation starts C1.45 v xtosc oscillation start voltage v hold C1.25 v xtosc oscillation hold voltage t stop 0.1 1000 ms xtosc stop detection time c g 10 15 20 pf xtosc internal capacitance c gex external c g option 10 30 pf xtosc external capacitance c d 10 15 20 pf xtosc internal capacitance c os 81216pf 400kosc internal capacitance f osc external resistor r os =300 k w v ss1 =C1.25 to C1.7 v 80 220 350 khz 400kosc oscillation frequency v por1 C0.4 0 v por generation voltage v por2 C1.5 C1.2 v por non-generation voltage when v ss1 is between v por1 and C1.5 v no por when v ss1 is between v por2 and C1.5 v 1 notes: 1. "xtosc" refers to the 32.768 khz crystal oscillation circuit. 2. "400kosc" refers to the 400 khz rc oscillation circuit. 3. "por" refers to power-on reset. 4. "t stop " indicates that a system reset occurs if xtosc stops oscillation for more than this duration.
18 MSM64164C ? semiconductor dc characteristics (continued) (v dd =0 v, v ss1 =v ss =C1.5 v, ta=C40 to +85 c unless otherwise specified) cpu in halt state (400k osc halt) parameter symbol condition unit measuring circuit power comsumption 1 i dd1 ta=C40 to +40c min. typ. max. 25 m a ta=+40 to +85c 230 m a cpu in operation state (400k osc halt) power comsumption 2 i dd2 ta=C40 to +40c 515 m a ta=+40 to +85c 540 m a cpu in operation state (400k osc in operation) r os =300k w power comsumption 3 i dd3 40 80 m a serial transfer, f sck =300 khz, cpu in operation state (400k osc halt) power comsumption 4 i dd4 ta=C40 to +40c ta=+40 to +85c cpu in halt state (400k osc halt), a/d converter in oscillation state power comsumption 5 i dd5 7 25 m a 7 50 m a 1 rt0=10 k w rt0=2 k w 150 230 m a 600 900 m a
19 ? semiconductor MSM64164C dc characteristics (continued) (v dd =0 v, v ss1 =v ssl =v ss =C1.5 v, v ss2 =C3.0 v, v ss3 =C4.5 v, ta=C40 to +85 c unless otherwise specified) parameter (pin name) symbol condition unit measuring circuit output current 1 i oh1 v oh1 =C0.5 v min. typ. max. C2.1 C0.7 C0.2 ma i ol1 v ol1 =v ss1 +0.5 v 1 3 9 ma output current 2 i oh2 C2.1 C0.7 C0.2 ma i ol2 v ol2 =v ss +0.5 v 0.2 0.7 2.1 ma 2 (p1.0) (p1.1 to p1.3) (p2.0 to p2.3) (p3.0 to p3.3) output current 3 i oh3 v oh3 =C0.7 v C1.8 C0.6 C0.2 ma i ol3 v ol3 =v ss1 +0.7 v 0.2 0.6 1.8 ma (bd) output current 4 i oh4 v oh4 =C0.1 v C1.1 C0.6 C0.3 ma i ol4 v ol4 =v ss1 +0.1 v 0.3 0.6 1.1 ma (rt0, rt1, rs0, rs1, crt0, cs0, cs1) output current 5 (when l26 to l33 are configured as output ports) i oh5 v oh5 =C0.5 v C1.5 C0.5 C0.1 ma i ol5 v ol5 =v ss1 +0.5 v 0.1 0.5 1.5 ma output current 6 i oh6 v oh6 =C0.5 v C2.1 C0.7 C0.2 ma i ol6 v ol6 =v ss1 +0.5 v 0.2 0.7 2.1 ma (osc2) i oh7 v oh7 =C0.2 v C4 m a i omh7 v omh7 =v ss1 +0.2 v 4 m a i omh7s v omh7s =v ss1 C0.2 v C4 m a i oml7 v oml7 =v ss2 +0.2 v 4 m a i oml7s v oml7s =v ss2 C0.2 v C4 m a i ol7 v ol7 =v ss3 +0.2 v 4 m a output current 7 (l0 to l33) output leakage current (p1.0 to p1.3) (p2.0 to p2.3) (p3.0 to p3.3) (rt0, rt1, rs0, rs1, crt0, cs0, cs1) i ooh v oh =v dd 0.3 m a i ool v ol =v ss1 C0.3 m a v oh2 =C0.5 v (v dd level) (v ss1 level) (v ss1 level) (v ss2 level) (v ss2 level) (v ss3 level) i ol1s v ss =C5 v, v ol1 =v ss +0.5 v 4 12 36 ma i ol2s v ss =C5 v, v ol2 =v ss +0.5 v 1 3 9 ma i ol5s v ss =C5 v, v ol5s =v ss +0.5 v 0.2 0.7 2.0 ma (p4.0 to p4.3) (p4.0 to p4.3) i oh5s v ss =C5v, v oh5s =C0.5 v C2.0 C0.7 C0.2 ma i oh1s v ss =C5 v, v oh1s =C0.5 v C36 C12 C4 ma i oh2s v ss =C5 v, v oh2s =C0.5 v C9 C3 C1 ma
20 MSM64164C ? semiconductor dc characteristics (continued) (v dd =0 v, v ss1 =v ssl =v ss =C1.5 v, v ss2 =C3.0 v, v ss3 =C4.5 v, ta=C40 to +85 c unless otherwise specified) parameter (pin name) symbol condition unit measuring circuit input current 1 i ih1 v ih1 =v dd (pull-down) min. typ. max. 51860 m a i il1 v il1 =v ss1 (pull-up) C60 C18 C5 m a 3 (p0.0 to p0.3) i ih1z v ih1 =v dd (high impedance) 0 1 m a i il1z v il1 =v ss (high impedance) C1 0 m a i ih2 v ih2 =v dd (pull-down) 5 18 60 m a i ih2z v ih2 =v dd (high impedance) 0 1 m a i il2z v il2 =v ss1 (high impedance) C1 0 m a i il3 v il3 =v ss1 (pull-up) C60 C22 C6 m a i ih3z v ih3 =v dd (high impedance) 0 1 m a i il3z v il3 =v ss1 (high impedance) C1 0 m a i ih4 v ih4 =v dd 01 m a i il4 v il4 =v ss1 C1.5 C0.75 C0.3 ma v ih1 C0.3 0 v v il1 C1.5 C1.2 v v ih2 C0.3 0 v v il2 C1.5 C1.2 v v ih3 C0.3 0 v v il3 C1.5 C1.2 v (p2.0 to p2.3) (p3.0 to p3.3) input current 2 (in0, in1) input current 3 (osc1) input current 4 ( reset , tst1 , tst2 ) input voltage 1 (p0.0 to p0.3) (p2.0 to p2.3) (p3.0 to p3.3) input voltage 2 (in0, in1, osc1) input voltage 3 ( reset , tst1 , tst2 ) 4 i ih1s v ih1 =v dd , v ss =C5 v (pull-down) 70 250 660 m a i il1s v il1 =v ss =C5 v (pull-up) C660 C250 C70 m a (p4.0 to p4.3) v ih1s C1 0 v v il1s C5 C4 v v ss =C5 v v ss =C5 v (p4.0 to p4.3)
21 ? semiconductor MSM64164C dc characteristics (continued) (v dd =0 v, v ss1 =v ssl =v ss =C1.5 v, v ss2 =C3.0 v, v ss3 =C4.5 v, ta=C40 to +85 c unless otherwise specified) parameter (pin name) symbol condition unit measuring circuit hysteresis width d v t1s v ss =C5 v min. typ. max. 0.25 1.0 1.5 v 4 (p0.0 to p0.3) d v t2 0.05 0.1 0.3 v c in 5pf (p2.0 to p2.3) (p3.0 to p3.3) hysteresis width ( reset , tst1 , tst2 ) input pin capacitance (p0.0 to p0.3) (p2.0 to p2.3) (p3.0 to p3.3) 1 d v t1 0.05 0.1 0.3 v (p4.0 to p4.3) (p4.0 to p4.3)
22 MSM64164C ? semiconductor measuring circuit 1 measuring circuit 2 v ih v il (*1) v dd v ss1 v ss2 v ss3 v ssl (*2) a input output v ss r os cl osc1 osc2 v ssl v dd v ss1 v ss2 v ss3 rt0 cs0 in0 rt0 ri0 cs0 xt xt c1 c2 xtal c12 cb ca v a v v ca, cb, c12, cl r os xtal rt0 cs0 ri0 : 0.1 m f : 300 k w : 32.768 khz : 10 k w /2 k w : 820 pf : 10 k w v ss
23 ? semiconductor MSM64164C measuring circuit 3 v dd v ss1 v ss2 v ss3 v ss a (*3) input output v ssl measuring circuit 4 *1 input logic to select a specified state. *2 to be repeated for the specified output pin. *3 to be repeated for the specified input pin. v ih v il (*3) v dd v ss1 v ss2 v ss3 v ssl input output waveform check v ss
24 MSM64164C ? semiconductor a/d converter characteristics (v dd =0 v, v ss1 =v ss =C1.5 v, ta=C40 to +85 c unless otherwise specified) * kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition. parameter symbol condition min. typ. max. unit measur- ing circuit resistor for oscillation cs0, ct0, cs1 3 740 pf 2 k w input current limiting resistor oscillation frequency rs?rt oscillation frequency ratio (*) ri0, ri1 f osc1 f osc2 f osc3 kf1 kf2 kf3 resistor for oscillation=2 k w resistor for oscillation=10 k w resistor for oscillation=200 k w rt0, rt0-1, rt1= 2 k w rt0, rt0-1, rt1=10 k w rt0, rt0-1, rt1=200 k w 1 165 41.8 2.55 3.89 0.990 0.0561 10 221 52.2 3.04 4.18 1 0.0584 256 60.6 3.53 4.35 1.010 0.0637 k w khz khz 5 rs0, rs1, rt0, rt0-1, rt1 khz kfx = f oscx (rs0-cs0 oscillation) f oscx (rt0-cs0 oscillation) (x=1,2,3) f oscx (rt0-1-cs0 oscillation) f oscx (rs0-cs0 oscillation) f osc x (rt1-cs1 oscillation) f osc x (rs1-cs1 oscillation) ,,
25 ? semiconductor MSM64164C measuring circuit 5 rt1 rs1 cs1 in1 in0 cs0 rs0 crt0 rt0 p4.3 v ss1 v ssl v dd reset tst1 tst2 p0.0 p0.1 p0.2 p0.3 cl d. u. t. frequency measurement (f oscx ) (crosc1) (crosc0) rt1 rs1 cs1 ri1 ri0 cs0 rs0 ct0 rt0-1 rt0 oscillation mode designation rt0, rt0-1, rt1 = 2 k w /10 k w /200 k w rs0, rs1 = 10 k w ri0, ri1 = 10 k w cs0, ct0, cs1 = 820 pf cl = 0.1 m f v ss
26 MSM64164C ? semiconductor ac characteristics (serial interface) (v dd =0 v, v ss1 =C1.5 v, v ss =C5 v, ta=C40 to +85 c) 1 m s sclk input fall time t f sclk input "h" level pulse width t cwh m s sclk input cycle time t cyc m s t cyc2( m ) m s m s 0.8 2.0 4.5 sout output delay time t ddr m s 0.4 0.5 m s 30.5 cpu is operating at 32 khz cpu is operating at 400 khz cl=10pf parameter symbol condition unit max. typ. min. t cyc1( m ) 0.8 m s t ds t dh 1 m s sclk input rise time t r 0.8 m s sclk input "l" level pulse width t cwl sclk output cycle time sclk output cycle time sin input setup time sin input hold time v ss =C5.25 v to v ss1 sclk (p4.2) sout (p4.0) sin (p3.3) 0v 0v 0v t cyc t cwh t cwl t ddr t ddr t dh t ds t ds t r t f ("h" level=C1 v, "l" level=C4 v)
27 ? semiconductor MSM64164C parameter symbol condition rating unit power supply voltage 1 v ss1 ta=25c C2.0 to +0.3 v in1 v in2 v out1 v out2 v out3 t stg v ss input, ta=25c v ss2 output, ta=25c v ss3 output, ta=25c v ss output, ta=25c power supply voltage 2 power supply voltage 3 power supply voltage 4 input voltage 1 input voltage 2 output voltage 1 output voltage 2 output voltage 3 storage temperature v ss2 v ss3 v ssl ta=25c ta=25c ta=25c v ss2 input, ta=25c C4.0 to +0.3 C5.5 to +0.3 C4.0 to +0.3 v ss2 C0.3 to +0.3 v ss C0.3 to +0.3 v ss2 C0.3 to +0.3 v ss3 C0.3 to +0.3 v ss C0.3 to +0.3 C55 to +125 v v v v v v v v v c (v dd =0 v) power supply voltage 5 v ss ta=25c C5.5 to +0.3 v v in3 v ssl input, ta=25c input voltage 3 v ssl C0.3 to +0.3 v v out4 v ssl output, ta=25c output voltage 4 v ssl C0.3 to +0.3 v absolute maximum ratings (3.0 v spec) parameter symbol condition range unit operating temperature t op C40 to +85 f xt operating voltage 400 khz osc external resistance x'tal oscillator frequency v ss2 r os using lcd with "duty 1/2" except using lcd with "duty 1/2" C3.5 to C2.2 C3.5 to C2.0 90 to 500 30 to 66 c v k w khz (v dd =0 v) C5.25 to (0.8?v ss2 , C2.0max.)* recommended operating conditions (3.0 v spec) * indicatates that the value of v ss is 80 % of v ss2 and should not exceed C2.0 v.
28 MSM64164C ? semiconductor electrical characteristics (3.0 v spec) dc characteristics (v dd =0 v, v ss2 =v ss =C3.0 v, ta=C40 to +85 c unless otherwise specified) parameter symbol condition unit measuring circuit v ss1 voltage v ss1 ca, cb, c12=0.1 m f min. typ. max. C1.7 C1.5 C1.3 +100% C50% v v ss3 voltage v ss3 ca, cb, c12=0.1 m f C4.7 C4.5 C4.3 +100% C50% v v ssl voltage v ssl C1.9 C1.3 C0.6 v v sta within 5 seconds after oscillation starts C2.0 v xtosc oscillation start voltage v hold C2.0 v xtosc oscillation hold voltage t stop 0.1 1000 ms xtosc stop detection time c g 10 15 20 pf xtosc internal capacitance c gex external c g option 10 30 pf xtosc external capacitance c d 10 15 20 pf xtosc internal capacitance c os 81216pf 400kosc internal capacitance f osc external resistor r os =100 k w v ss2 =C2.0 to C3.5 v 300 400 620 khz 400kosc oscillation frequency v por1 C0.7 0 v por generation voltage v por2 C3 C2 v por non-generation voltage when v ss2 is between v por1 and C3.0 v no por when v ss2 is between v por2 and C3.0 v 1 notes: 1. "xtosc" refers to the 32.768 khz x'tal oscillation circuit. 2. "400kosc" refers to the 400 khz rc oscillation circuit. 3. "por" refers to power-on reset. 4. "t stop " indicates that a system reset occurs if xtosc stops oscillation for more than this duration.
29 ? semiconductor MSM64164C dc characteristics (continued) (v dd =0 v, v ss2 =v ss =C3.0 v, ta=C40 to +85 c unless otherwise specified) serial transfer, f sck =300 khz, cpu operation state (400k osc halt) cpu in halt state (400k osc halt) parameter symbol condition unit measuring circuit current comsumption 1 i dd1 ta=C40 to +40c min. typ. max. 1.5 4.5 m a ta=+40 to +85c 1.5 30 m a cpu in operation state (400k osc halt) current comsumption 2 i dd2 ta=C40 to +40c 515 m a ta=+40 to +85c 540 m a cpu in operation state (400k osc in operation) current comsumption 3 i dd3 220 450 m a current comsumption 4 i dd4 ta=C40 to +40c ta=+40 to +85c current comsumption 5 i dd5 7 25 m a 7 50 m a 1 cpu in halt state (400k osc halt), a/d converter in oscillation state rt0=10 k w rt0=2 k w 300 450 m a 1300 2000 m a
30 MSM64164C ? semiconductor dc characteristics (continued) (v dd =0 v, v ss1 =v ssl =C1.5 v, v ss2 =v ss =C3.0 v, v ss3 =C4.5 v, ta=C40 to +85 c unless otherwise specified) parameter (pin name) symbol condition unit measuring circuit output current 1 i oh1 v oh1 =C0.5 v min. typ. max. C6 C2 C0.7 ma i ol1 v ol1 =v ss +0.5 v 3 8 25 ma output current 2 i oh2 C6 C2 C0.7 ma i ol2 v ol2 =v ss +0.5 v 0.7 2 6 ma 2 (p1.0) (p1.1 to p1.3) (p2.0 to p2.3) (p3.0 to p3.3) output current 3 i oh3 v oh3 =C0.7 v C6 C2 C0.7 ma i ol3 v ol3 =v ss2 +0.7 v 0.7 2 6 ma (bd) output current 4 i oh4 v oh4 =C0.1 v C2.5 C1.3 C0.7 ma i ol4 v ol4 =v ss2 +0.1 v 0.7 1.3 2.5 ma (rt0, rt1, rs0, rs1, crt0, cs0, cs1) output current 5 (when l26 to l33 are configured as output ports.) i oh5 v oh5 =C0.5 v C1.5 C0.6 C0.15 ma i ol5s v ss =C5 v, v ol5s =v ss +0.5 v 0.2 0.7 2.0 ma output current 6 i oh6 v oh6 =C0.5 v C6 C2 C0.7 ma i ol6 v ol6 =v ss2 +0.5 v 0.7 2 6 ma (osc2) i oh7 v oh7 =C0.2 v C4 m a i omh7 v omh7 =v ss1 +0.2 v 4 m a i omh7s v omh7s =v ss1 C0.2 v C4 m a i oml7 v oml7 =v ss2 +0.2 v 4 m a i oml7s v oml7s =v ss2 C0.2 v C4 m a i ol7 v ol7 =v ss3 +0.2 v 4 m a output current 7 (l0 to l33) output leakage (p1.0 to p1.3) (p2.0 to p2.3) (p4.0 to p4.3) (rt0, rt1, rs0, rs1, crt0, cs0, cs1) i ooh v oh =v dd 0.3 m a i ool v ol =v ss2 C0.3 m a v oh2 =C0.5 v (v dd level) (v ss1 level) (v ss1 level) (v ss2 level) (v ss2 level) (v ss3 level) i ol1s v ss =C5 v, v ol1 =v ss +0.5 v 4 12 36 ma i ol2s v ss =C5 v, v ol2 =v ss +0.5 v 1 3 9 ma (p4.0 to p4.3) i ol5 v ol5 =v ss +0.5 v 0.15 0.6 1.5 ma (p3.0 to p3.3) i oh1s v ss =C5 v, v oh1s =C0.5 v C36 C12 C4 ma i oh2s v ss =C5 v, v oh2s =C0.5 v C9 C3 C1 ma i oh5s v ss =C5 v, v oh5s =C0.5 v C2.0 C0.7 C0.2 ma
31 ? semiconductor MSM64164C dc characteristics (continued) (v dd =0 v, v ss1 =v ssl =C1.5 v, v ss2 =v ss =C3.0 v, v ss3 =C4.5 v, ta=C40 to +85 c unless otherwise specified) parameter (pin name) symbol condition unit measuring circuit input current 1 i ih1 v ih1 =v dd (pull-down) min. typ. max. 30 90 300 m a i il1 v il1 =v ss (pull-up) C300 C90 C30 m a 3 (p0.0 to p0.3) i ih1z v ih1 =v dd (high impedance) 0 1 m a i il1z v il1 =v ss (high impedance) C1 0 m a i ih2 v ih2 =v dd (pull-down) 30 90 300 m a i ih2z v ih2 =v dd (high impedance) 0 1 m a i il2z v il2 =v ss2 (high impedance) C1 0 m a i il3 v il3 =v ss2 (pull-up) C300 C110 C10 m a i ih3z v ih3 =v dd (high impedance) 0 1 m a i il3z v il3 =v ss2 (high impedance) C1 0 m a i ih4 v ih4 =v dd 01 m a i il4 v il4 =v ss2 C3 C1.5 C0.75 ma v ih1 C0.6 0 v v il1 C3.0 C2.4 v v ih2 C0.6 0 v v il2 C3.0 C2.4 v v ih3 C0.6 0 v v il3 C3.0 C2.4 v (p2.0 to p2.3) (p3.0 to p3.3) input current 2 (in0, in1) input current 3 (osc1) input current 4 ( reset , tst1 , tst2 ) input voltage 1 (p0.0 to p0.3) (p2.0 to p2.3) (p3.0 to p3.3) input voltage 2 (in0, in1, osc1) input voltage 3 ( reset , tst1 , tst2 ) 4 (p4.0 to p4.3) i ih1s v ih1 =v dd, v ss =C5 v (pull-down) 80 250 800 m a i il1s v il1 =v ss =C5 v (pull-up) C800 C250 C80 m a v ih1s C1 0 v v il1s C5 C4 v v ss =C5 v v ss =C5 v (p4.0 to p4.3)
32 MSM64164C ? semiconductor dc characteristics (continued) (v dd =0 v, v ss1 =v ssl =C1.5 v, v ss2 =v ss =C3.0 v, v ss3 =C4.5 v, ta=C40 to +85 c unless otherwise specified) parameter (pin name) symbol condition unit measuring circuit hysteresis width d v t1s v ss =C5 v min. typ. max. 0.25 1.0 1.5 v 4 (p0.0 to p0.3) d v t2 0.2 0.5 1 v c in 5pf (p2.0 to p2.3) (p3.0 to p3.3) hysteresis width ( reset , tst1 , tst2 ) input pin capacitance (p0.0 to p0.3) (p2.0 to p2.3) (p3.0 to p3.3) 1 (p4.0 to p4.3) d v t1 0.2 0.5 1 v (p4.0 to p4.3)
33 ? semiconductor MSM64164C measuring circuit 1 measuring circuit 2 v ih v il (*1) v dd v ss1 v ss2 v ss3 v ssl (*2) a input output v ss ros cl osc1 osc2 v ssl v dd v ss2 v ss1 v ss3 rt0 cs0 in0 rt0 ri0 cs0 xt xt c1 c2 xtal c12 cb ca v a v v cl ca, cb, c12 ros xtal rt0 cs0 ri0 : 0.47 m f : 0.1 m f : 100 k w : 32.768 khz : 10 k w /2 k w : 820 pf : 10 k w v ss
34 MSM64164C ? semiconductor measuring circuit 3 v dd v ss1 v ss2 v ss3 v ssl a (*3) input output v ss measuring circuit 4 *1 input logic to select a specified state. *2 to be repeated for the specified output pin. *3 to be repeated for the specified input pin. v ih v il (*3) v dd v ss1 v ss2 v ss3 v ssl input output waveform check v ss
35 ? semiconductor MSM64164C a/d converter characteristics (v dd =0 v, v ss2 =v ss =C3.0 v, ta=C40 to +85 c unless otherwise specified) parameter symbol condition min. typ. max. unit measur- ing circuit resistor for oscillation cs0, ct0, cs1 3 740 pf 1 k w input current limiting resistor oscillation frequency rs?rt oscillation frequency ratio (*) ri0, ri1 f osc1 f osc2 f osc3 kf1 kf2 kf3 resistor for oscillation=2 k w resistor for oscillation=10 k w resistor for oscillation=200 k w rt0, rt0-1, rt1= 2 k w rt0, rt0-1, rt1=10 k w rt0, rt0-1, rt1=200 k w 1 200 46.5 2.79 4.115 0.990 0.0573 10 239 55.4 3.32 4.22 1 0.0616 277 64.3 3.85 4.326 1.010 0.0659 k w khz khz 5 kfx = f oscx (rs0-cs0 oscillation) f oscx (rt0-cs0 oscillation) ( x=1 , 2 , 3 ) rs0, rs1, rt0, rt0-1, rt1 khz f oscx (rt0-1-cs0 oscillation) f oscx (rs0-cs0 oscillation) f oscx (rt1-cs1 oscillation) f oscx (rs1-cs1 oscillation) ,, * kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.
36 MSM64164C ? semiconductor measuring circuit 5 rt1 rs1 cs1 in1 in0 cs0 rs0 crt0 rt0 p4.3 v ss2 v ssl v dd reset tst1 tst2 p0.0 p0.1 p0.2 p0.3 cl d. u. t. frequency measurement (f oscx ) (crosc1) (crosc0) rt1 rs1 cs1 ri1 ri0 cs0 rs0 ct0 rt0-1 rt0 oscillation mode designation rt0, rt0-1, rt1 = 2 k w /10 k w /200 k w rs0, rs1 = 10 k w ri0, ri1 = 10 k w cs0, ct0, cs1 = 820 pf cl = 0.47 m f v ss
37 ? semiconductor MSM64164C ac characteristics (serial interface) (v dd =0 v, v ss2 =C3 v, v ss =C5 v, ta=C40 to +85 c) 1 m s sclk input fall time t f sclk input "h" level pulse width t cwh m s sclk input cycle time t cyc m s t cyc2( m ) m s m s 0.8 2.0 2.5 sout output delay time t ddr m s 0.4 0.5 m s 30.5 cpu is operating at 32 khz cpu is operating at 400 khz cl=10pf parameter symbol condition unit max. typ. min. t cyc1( m ) 0.8 m s t ds t dh 1 m s sclk input rise time t r 0.8 m s sclk input "l" level pulse width t cwl sclk output cycle time sclk output cycle time sin input setup time sin input hold time sclk (p4.2) sout (p4.0) sin (p3.3) 0v 0v 0v t cyc t cwh t cwl t ddr t ddr t dh t ds t ds t r t f ("h" level=C1 v, "l" level=C4 v)
38 MSM64164C ? semiconductor functional description cpu peripheral function ? a/d converter (adc) the MSM64164C has a built-in two-channel rc oscillation a/d converter. the a/d converter is composed of a two-channel oscillation circuit, counter a (cnta0 to 4 is a 4.8-digit decade counter), counter b (cntb0 to 3 is a 14-bit binary counter), and a/d converter control registers 0 and 1 (adcon0, adcon1). by counting oscillation frequencies due to a resistor or capacitor connected to the rc oscillation circuit, the a/d converter converts resistance values or capacitance values to corresponding digital values. by using a thermistor or humidity sensor as a resistance, a thermometer or a hygrometer can be constructed. by applying sensors to the two-channel rc oscillation circuit, it is also possible to extend measurement ranges or measurement at two places. ? serial port (siop) the MSM64164C has an 8-bit synchronous serial port. receive/transmit operation of the serial port is performed simultaneously and the serial transfer clock can select either internal or external mode. direction of transfer data can be big endian or little endian. each pin of the serial port is assigned as secondary functions of p3.3 and p4.0 to p4.2. setting each bit of sin, sout, spr and sclk of p33con and p40con to p42con to "1" makes each pin valid. ? lcd driver (lcd) the MSM64164C has a built-in lcd driver for 34 outputs. the lcd driver consists of 31 4-bit display registers (dspr0 to 30), a display control register (dspcon), a 34-output lcd driver circuit, and a bias generation circuit (bias). there are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. a mask option can select either a common driver or a segment driver for each lcd driver pin. a mask option can also specify assignment of each bit of the display register to each segment. all the display registers must be selected by a mask option. l26 to l33 of the lcd driver can become output ports by a mask option. the relationship between the duty, the bias method, and the maximum segment number follows: 1/4 duty 1/3 bias method -------- 120 segments 1/3 duty 1/3 bias method -------- 93 segments 1/2 duty 1/2 bias method -------- 64 segments ? buzzer driver (bd) the MSM64164C has a built-in buzzer driver with 15 buzzer output frequencies and four buzzer output modes. each buzzer output is selected by the buzzer control register (bdcon) and the buzzer frequency control register (bfcon). ? capture circuit (capr) the MSM64164C captures 32 hz to 256 hz output of the time base counter at the falling of port 0.0 or 0.1 (p0.0 or p0.1) to l level when the pull-up resistance input is chosen or at the rising to h level when the pull-down resistance input is chosen. the capture circuit is composed of the capture control register (capcon) and the capture registers (capr0, capr1) that fetch output from the time base counter.
39 ? semiconductor MSM64164C ? watchdog timer (wdt) the MSM64164C has a built-in watchdog timer for reliable cpu operation. the watchdog timer is composed of a 6-bit watchdog timer counter (wdtc) to count a 16hz output and a watchdog timer control register (wdtcon) to reset wdtc. ? clock generation circuit (2clk) the clock generation circuit (2clk) in the MSM64164C contains a 32.768 khz crystal oscillation circuit, a 400 khz rc oscillation circuit, and a clock control port. this circuit generates the system clock (clk) and the time base clock (32.768 khz). the system clock drives the cpu while the time base clock drives the time base counter and the buzzer driver. via the contents of the frequency control register (fcon), the system clock can be switched between 32.768 khz (the output of the x'tal oscillation circuit) and 400 khz (the output of the rc oscillation circuit). note: the oscillation frequency of the rc oscillation circuit varies depending on the value of an external resistor (r os ), operating power supply voltage (v dd ), and ambient temperatures (ta). in this manual, the output of the rc oscillation circuit is taken as 400 khz for convenience. ? time base counter (tbc) the MSM64164C has a built-in time base counter (tbc) that generates clocks to be supplied to internal peripheral circuits. the time base counter is composed of 15 binary counters. the count clock of the time base is driven by the oscillation clock (32.768 khz) of the crystal oscillation circuit. the output of the time base counter is used for the buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture circuit. ? i/o port input-output ports (p2, p3, p4) (12 bits) : pull-up (down) input, high z input, cmos output, nmos open-drain output ; settable individually, "0" for external interrupts. input ports (p0) (4 bits) : pull-up (down) input, high z input, "1" for external interrupts. output ports (p1) (4 bits) : cmos output, nmos open drain output. ? interrupt (intc) the MSM64164C has ten interrupt sources (10 vector addresses) of which two are external interrupts from ports and eight are internal interrupts. of the ten interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). the other nine interrupts are controlled by the master interrupt enable flag (mi) and the interrupt enable the registers (ie0, ie1 and ie2). when an interrupt condition is met, cpu the branches to a vector address corresponding to the interrupt source.
40 MSM64164C ? semiconductor application circuits 3.0 v spec. application circuit rt1 rs1 cs1 ri1 l33 l0 osc2 osc1 xt xt reset p1.0 p1.1 p1.2 p1.3 p0.0 p0.1 p0.2 p0.3 tst1 tst2 v ssl v ss1 v ss2 v ss3 c1 c2 v dd 3 v c2 c12 cb ca cl r os 32.768khz cgex ri0 rt0 buzzer osc monitor in0 cs0 rs0 crt0 rt0 in1 cs1 rs1 rt1 bd p4.3 p4.2 MSM64164C-xxx (3.0 v spec.) l c d cs0 rs0 ? with 5 v interface ? temperature measurement by two thermistors ? c gex of crystal oscillator : external switch matrix (4 4) v ss 5 v cs p4.1 p4.0 p3.3 sclk spr sout sin to serial communication interface (to 5 v (v ss ) system)
41 ? semiconductor MSM64164C application circuits (continued) 1.5 v spec. application circuit l33 l0 osc2 osc1 xt xt reset p1.0 p1.1 p1.2 p1.3 p0.0 p0.1 p0.2 p0.3 tst1 tst2 v ssl v ss1 v ss2 v ss3 c1 c2 v dd 1.5 v c1 c12 cb cl r os 32.768khz switch matrix (4 4) rt1 rs1 cs1 ri1 rs0 rt0 buzzer in0 cs0 rs0 crt0 rt0 in1 cs1 rs1 rt1 bd p4.3 MSM64164C-xxx (1.5 v spec.) l c d ca ri0 cs0 ? without 5 v interface ? temperature measurement by two thermistors ? c g of crystal oscillator : internal v ss p4.2 p4.1 p4.0 p3.3


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